PRODUCTS
Cutting Tip Outer Edge Grinding Resin Wheel "i-Surface"
Grinding and Polishing Tools
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Grinding Wheels
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- Beveling Wheel for Wafer
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- Grain Single-layered Metal Bonded CBN Wheel "CBN Grit Ace"
- Honing Wheel Applicable to Water Soluble Coolant
- Grinding Wheel for Super-Hard Drill and Endmill Grinding "i-Flute"
- Cutting Tip Outer Edge Grinding Resin Wheel "i-Surface"
- Resin Bond Wheel for High Quality Profile Grinding "Keep Bright"
- Metal Bond Wheel for High Accuracy Profile Grinding "Keep Edge"
- General-use Multi-pore Diamond Grinding Wheel "SD MEMOX"
- Poreless Vitrified Diamond PCD Grinding Wheel "Smooth Fine"
- Surface Grinding Wheel for Solar Cell Silicon Ingots
- Porous Vitrified-bonded Diamond Wheel "VDH Wheel"
- Vitrified-bond Wheel for Cutting Tip Outer Edge Grinding "VTS Wheel"
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- NORITAKE TECHNICAL JOURNAL of Grinding & Polishing Technical Information
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Technical Support
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Grinding the outer edge of replaceable blade tips requires a higher level of precision and machining performance. However, since this process greatly impacts the grain, normal resin is unable to retain its grain, and sharpness becomes a problem.
i-Surface has improved grain retention, enabling improved sharpening and dressing intervals.
Features
With its high grain retention, the grinding wheel retains cutting performance and wear is greatly reduced, enabling high-performance machining and longer adjustment intervals.
In addition, the i-Surface can have a finer grain than standard resins under the same conditions, resulting in less chipping and making it effective for use with materials that chip easily.
Applications
- Extra-hard
- Cermet
- Grinding the outer edge of cutting tips for ceramics
Grinding Data
| Machine | Outer edge grinding machine |
|---|---|
| Stock removal | 0.3mm |
| Coolants | Water-soluble |
| Wheel (grit size) | Standard resin SDC325 i-Surface SDC500 |
| Workpiece | Grinding tip: cermet |
| Chipping | 0.02mm or less |
