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Thick Film Circuit Substrate with Copper Conductors design guidance
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Thick Film Circuit Substrate
- Thick Film Circuit Substrate with Precious Metal design guidance
- About Our Technology
- New Copper Conductors + Plating Substrate design guidance
- Thick Film Circuit Substrate with Copper Conductors design guidance
- Thick Film Heater design guidance
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| Item | Specification | Condition | |||
|---|---|---|---|---|---|
| Conductor | Resistivity | Cu 2mΩ/□ | 20 μm thick equivalent | ||
| Adhesion | Initial | ≧2.5Kg | Φ0.6 mm tin-plated copper trace wire Pad size: 2 mm□ |
||
| Aged (150°C, 48 hrs) |
≧2.0Kg | ||||
| Solder leach resistance | Solder leach ≤ 40 μm | Line width: 500 μm Solder: 62Sn/36Pb/2Ag 235°C, 5 sec, 3 cycles |
|||
| Item | Preferable | Available | Condition | ||
| Resistor | Resistance value | 10 to 2MΩ | |||
| TCR | ±300ppm / °C | -55 to 25°C, 25 to 125°C | |||
| ±150ppm / °C | |||||
| Rated power | 40 to 600mW / mm2 | ||||
| Resistance tolerance | ≧±1.0% | ||||
| Stability | Thermal shock | ≦±1.5% | 235°C, 10 sec, 1 cycle | ||
| H.H.B.T. | ≦±2.0% | 85°C, 85% RH, 1,000 hours | |||
| Thermal cycle | ≦±1.5% | -40°C – 150°C, 500 cycles | |||
| High-temperature storage | ≦±2.0% | 150°C, 1,000 hours | |||
- Please consult with us about special you may have for fine-pattern traces, highly accurate resistance values, and low TCR boards.
- Please consult with us about assembled products,requirements lead pin attachment, etc such as electronic component assembly and.
