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New Copper Conductors + Plating Substrate design guidance
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Thick Film Circuit Substrate
- Thick Film Circuit Substrate with Precious Metal design guidance
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- New Copper Conductors + Plating Substrate design guidance
- Thick Film Circuit Substrate with Copper Conductors design guidance
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Porous ceramic component
Ceramic cores
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|
Item |
Specification | |
|---|---|---|
| Conductor | Line & Space | Min. 200μm / 200μm |
| Pad size | Min. 0.7mm□ | |
| Film thickness | Typ. 15μm | |
| Item | Specification | |
| Resister |
Sheet resistance |
30～5k Ω/□ |
| Tolerance of resistance | Without trimming：+/-30% With trimming：+/-3～5% |
|
| Conductor / Resister overlap | Min. 200μm | |
| Item | Specification | |
| Protector | Tone of color | Clear or white |
| Film thickness | Max. 20μm | |
| Condutor <=>Protector space | Min. 200μm | |
| Item | Specification | |
| Plating | Film thickness | Ni:4～7μm / Pd:0.1～0.3μm / Au:0.03～0.07μm |
| Item | Specification | |
| Printing |
Dimentional tolerance |
+/-100μm |
| Position accuracy | +200μm / -150μm | |
